Nexchip, a prominent 12-inch pure wafer foundry based in China, has officially made its debut on the Hong Kong Stock Exchange as of July 10. This listing marks a significant achievement for the company, positioning it as the third mainland foundry to secure a dual listing, following in the footsteps of SMIC and Shanghai Huali.

On its first trading day, Nexchip's stock opened with an impressive 11% increase, reaching a price of HKD 36 per share, which brought the company's total market capitalization to approximately HKD 75.8 billion (around TWD 308.2 billion). Following revenue statistics from 2025, Nexchip is now recognized as the ninth largest foundry globally and the third largest in mainland China.

Reports indicate that the listing attracted interest from 20 institutional investors, including notable asset management firms and industry leaders such as Hillhouse Capital, Shanghai Gao Yi, Goertek, and Chery Automobile. These investors collectively accounted for 49.92% of the global share offering, with total subscriptions amounting to approximately HKD 3.372 billion.

Nexchip plans to utilize the funds raised from this listing primarily for the research and optimization of its new 22nm technology platform. The company also aims to establish a research and sales center in Hong Kong, which will provide stable financial support for its technological advancements and global expansion efforts.

From 2020 to 2025, Nexchip has demonstrated the fastest capacity expansion and revenue growth among the top ten foundries worldwide. Revenue is projected to grow consecutively over three years, increasing from RMB 7.183 billion to RMB 10.388 billion. Historically, Nexchip has focused on display driver ICs (DDIC) as its core manufacturing product. However, starting in 2024, it plans to expand its portfolio to include CIS image sensors and PMIC power management chips as new core growth products.

Currently, Nexchip has established a 12-inch wafer foundry base in Hefei, Anhui, with monthly wafer production expected to rise from 79,800 units to 139,000 units between 2023 and 2025. In the first four months of 2026, the company reported a shipment volume of 606,000 wafers. Over the past three years, Nexchip has invested over RMB 3.7 billion in research and development, completing the development of a 28nm logic chip platform and holding a total of 1,057 invention patents by the end of 2025.

With support from its largest shareholder, Hefei Construction Investment Group, which holds 39.71% of the shares, the management team remains optimistic about the future development of the industry. By successfully tapping into international financing through this listing, Nexchip aims to alleviate the financial and depreciation pressures associated with expansion while enhancing its connections with global capital and overseas clients.

Looking ahead, as the demand for core chips such as PMICs, MCUs, and DDICs continues to rise due to the explosion of AI smart devices, automotive electronics, and robotics, Nexchip is poised to leverage its technological, capacity, and capital advantages to lead the domestic mature process market and contribute to the high-quality upgrade of the semiconductor industry.