During a recent seminar titled "The AI Era: Challenges and Opportunities from FPT's Perspective," FPT's leadership addressed the rapid development of artificial intelligence (AI) and the competitive landscape shaped by Chinese and Indian tech firms. A key focus was the impact of low-cost AI models, such as DeepSeek, on FPT's market position.

Phạm Minh Tuấn, Deputy General Director of FPT and CEO of FPT Software, emphasized that FPT adopts a multi-model strategy rather than relying on a single technology. This approach allows the company to balance quality, speed, and cost when selecting AI solutions for clients. He noted that using an expensive model for a problem that only requires moderate value would not ensure economic efficiency.

FPT's strategy involves integrating various models, including those from the U.S. and China, to find the most suitable solution for specific client needs. Tuấn stated, "Models like DeepSeek or those developed by FPT can be utilized. The key is to select the optimal model for each problem." Instead of competing in the costly race to build foundational AI models, FPT focuses on specialized segments, leveraging unique datasets and developing reusable technology assets to apply AI to specific customer challenges.

Regarding China's advancements in DUV lithography, Tuấn explained that the primary impact lies in semiconductor manufacturing. While FPT is more focused on chip design, he believes that expanded manufacturing capabilities and reduced production costs could increase demand for design services and the number of products. He stated, "Lithography machines concentrate on production, while we mainly handle design. As production capacity increases and costs decrease, FPT's opportunities will grow."

Tuấn's perspective suggests that advancements in semiconductor manufacturing technology do not necessarily limit FPT's potential. Instead, access to lower-cost production capabilities could facilitate the commercialization of chip designs, thereby expanding market opportunities for design-focused companies.

DUV lithography, which stands for Deep Ultraviolet Lithography, is a technology that uses deep ultraviolet light to create ultra-fine circuit patterns on silicon wafers during chip production. The process involves projecting light through a circuit mask, with lens systems shrinking and focusing the image onto a light-sensitive layer on the wafer's surface. This step is repeated multiple times to form the chip's structural layers. DUV machines typically use KrF lasers with a wavelength of 248 nm or ArF lasers with a wavelength of 193 nm. The ArF immersion version places a layer of ultra-pure water between the lens and wafer to enhance resolution, allowing for the creation of smaller details.

Currently, DUV remains a key technology in semiconductor factories, utilized for most layers of chips, from mainstream chips to some advanced production processes. For extremely small details, manufacturers must employ multiple exposure techniques or transition to EUV machines with a wavelength of 13.5 nm. While DUV has lower resolution compared to EUV, it is a mature technology with high productivity and lower acquisition and operational costs.