Manz AG developed a breakthrough production solution of panel-level packaging to seize the growth of automotive semiconductor

Axcelis Announces Participation in SEMICON Japan 2024

BEVERLY, Mass., Dec. 3, 2024 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier

Leading Korean OSAT Purchases YES VertaCure™ XP for Higher Yield and Performance

ERS introduces Wave3000, a State-of-the-Art Warpage Metrology Tool for Advanced Packaging Wafers

STATS ChipPAC's Automotive Millimeter Wave Radar Packaging Solution Receives Customer Award

SurplusGLOBAL to Showcase Legacy RF GENERATOR and RF MATCHER at SEMICON TAIWAN 2023

SEOUL, South Korea, Aug. 28, 2023 /PRNewswire/ -- SurplusGLOBAL has announced its participation in SEMICON

Global Total Semiconductor Equipment Sales Forecast to Reach Record $124 Billion in 2025, SEMI Reports

TOKYO, Dec. 12, 2023 /PRNewswire/ -- Global sales of total semiconductor manufacturing equipment by original

JCET's Corporate Value Recognized with China Top 100 Enterprise Award

Global Semiconductor Materials Market Revenue Reaches Record $73 Billion in 2022, SEMI Reports